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The production of extrudedheatsinksare CNC machined according to your customer-specific specifications. Special profiles and surfaces can also be realised in-house according to your specifications.
Fischer Elektronik GmbH & Co. KG
- universal clip-onheatsinksfor design TO 220, TO218, TO247 and similar - integrated clamp geometry for a secure fixing of the devive - angled designs with enlarged surface - modifications and special designs according ...
Fischer Elektronik GmbH & Co. KG
Theheatsinksare already mechanically adapted to the different processor types and can be attached by screw or adhesive fastening, depending on the version. Double-sided adhesiveheat-conducting ...
Fischer Elektronik GmbH & Co. KG
... producing and processing field. CVD Diamond is the mostheat导电材料,heatconductivity in normal temperature is 2000WK-1 m-1, which is five times as much as cooper, even theheat...
Characteristics ●Aluminumheatsink●DIN rail mounting TS35 ●Mounting of the SSR without mechanical processing
Profile type - ExtrudedheatsinkDimensions - 34x60 mm Base thickness - 12 mm Weight - 2,84 kg/mt Thermal resistance Rth bei Natural convection - 4,3 C/W Rth bei length - 50 mm
CTX Thermal Solutions
Profile type - ExtrudedheatsinkDimensions - 24x20 mm Base thickness - 2,5 mm Weight - 0,54 kg/mt Thermal resistance Rth in natural convection - 12,9 C/W Rth in length - 50 mm
CTX Thermal Solutions
Profile type - ExtrudedheatsinkDimensions - 85x18 mm Base thickness - 4,5 mm Weight - 1,45 kg/mt Thermal resistance Rth in natural convection - 4,0 C/W Rth in length - 100 mm
CTX Thermal Solutions
Delta Thermal Management Products (Coolers) provide thermal solutions for desktop computers, servers, game boxes, Telecom, household appliances and VGA cards. Delta employs highly experienced design engineers that are knowledgeable in ...
Aavid Thermalloy has developed a new series of extrusions to satisfy the requirements of our customers with a view to boosting the performance of their applications. The improved extrusion process, which has been studied in cooperation ...
Aavid Thermalloy
Cold Plates – Liquid-CooledHeatSinksBrazed aluminum with robust design features offers thermal and mechanical advantages in electronics cooling.Optimal thermal designHi thermal conductivity to coolantFlexible ...
AKG
1. Air CoolingHeatsinkfor modules only 2. Outlook Code 3. Length(mm)
... for bigger parts. DescriptionHeatsinksare mechanical parts made of standard or specific profiles. It is used for thermal management of electric components of any sizes (mainly cooling). It dissipatesheat...
... surface. The package also includesheattransfer pads to ensure the efficiency of the cooling. It was designed for Raspberry Pi 3 but on request we can make for any other devices. Installing Place theheat...
Levtech Service Production SRL
D6 manufactures a line of dual fan forced air cooling assemblies. These assemblies are designed to accommodate two 120mm fans. Many standard lengths are stocked, while custom lengths can be manufactured in as little as 3 – 4 weeks ...
D6 Industries, Inc.
Our active and passive cooling solutions for Qseven, COM Express and SMARC provide highly efficientheatremoval as they reduce operating temperatures considerably, thereby enhancing the performance of your application. ...
High-efficiencyheatsinkfor LED lighting Cold-forged aluminum (Al 1070) Optimized pin pattern for mounting at all angles Diameter 51mm Height 50 or 70mm Base thickness 10mm for maximum security ...
Cooliance GmbH
The BGAHeatSinkis a 17 x 17 x 17.5 mm standardheat sinkwith thermal tape. It is made of aluminium with blue anodized finish. Series: maxiFLOW, superGRIP™ Type: Top Mount Material: ...
Heatsinkfor Power LEDs from 1W and 3W; 109,90mm diameter, 54,00mm height; Standard AR111
KHATOD OPTOELECTRONIC S.r.l.
Air Cooled Assemblies The most efficient way to removeheatfrom a large area semiconductor (>23mm silicon diameter) is to package it into a flat circular package that allowsheat和current to flow ...
Applied Power Systems, Inc
Efficientheatsinksare an essential component of any power semiconductor system and PPI have a wide range of extruded aluminiumheatsinksavailable from stock. We can also provideheatsinks...
Power Products International
These surfacemountheatsinksare extruded not stamped. This extruded designs are far more efficient than any stamped counterpart. One of the main issues is gettingheatfrom the board level into theheatsink. ...
Ohmite
The FHS-090 Series of integrated-fanheatsinksis uniquely designed to absorb and disperseheataway from high temperature devices while offering key features such as an operating temperature ...
... SSR's dissipateheatduring switching. When using an SSR this problem ofheatdissipation must be managed. It is very important to select the correctheatsinkto allow maximum performance ...
... removeheatfrom aheatsource (device) to the ambient via aheattransfer media (i.e.heatsink). USE: Apply to all mounting and threaded surfaces ...
Bespoke cooling We offerheatsinksolutions made from a wide range of alloys, with a particular focus on automotive and industrial standards. Our service portfolio comprises die-cast aluminium, surface quality adjustment ...
... head must be attached to aheatsinkproviding good thermal resistance. This value is the difference between the maximum operating laser base plate temperature (50˚C) and the maximum ambient temperature at the air-heatsink...
COBOLT
A heat sink cools electronic components and power semiconductors to avoid damage from overheating. The component is attached to the metal sink whose fins facilitate heat dissipation by convection.
ApplicationsThese devices are used in electronics to cool processors and power and amplification circuits.
TechnologiesVertical orientation is preferred in the case of passive convection. A fan can be added if necessary. The shape of the sink is adapted to that of the component. Its structure increases the heat dissipation surface area. Some are available in the form of bars that can be cut to size.
The sink's dissipation capacity is a function of its thermal resistance, expressed in degrees Celsius per watt (°C/W). The value should be as low as possible. Calculation of size is based on thermal resistance, ambient temperature, acceptable junction temperature of the component and the power it will dissipate.
The component is screwed or clipped to the sink, or attached using a thermo-conductive adhesive. Generally, the two must be electrically isolated. This is accomplished using a mica insulator and a thermo-conductive silicone or silver paste, or a flexible silicone insulator without paste.
Choice of heat sink will depend on component configuration and thermal resistance, using the appropriate calculations.
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