内存chips
{{#each product.specData:i}}{{name}}: {{value}} {{#i!=(product.specData.length-1)}}
{{/end}} {{/each}}
{{{product.idpText}}}
{{#each product.specData:i}}{{name}}: {{value}} {{#i!=(product.specData.length-1)}}
{{/end}} {{/each}}
{{{product.idpText}}}
内存capacity: 8, 16 GB
。.. suited for industrial and IoT applications, the ADATA IEM5141A is a compact, easy-to-install device with integrated flashmemoryand controller in a Ball Grid Array (BGA) package. It meets the JEDEC eMMC 5.1 standard ...
内存capacity: 16, 32 GB
。.. suited for industrial and IoT applications, the ADATA IEM5141A is a compact, easy-to-install device with integrated flashmemoryand controller in a Ball Grid Array (BGA) package. It meets the JEDEC eMMC 5.1 standard ...
内存capacity: 8 GB
GDDR6, the next GraphicDRAMproduct, has increased performance and decreased power consumption to provide optimized solution for 3D Graphic and 8K resolution. GDDR6 is key ingredient for high-performance application ...
Hynix
For Serial EEPROM devices, Atmel is known to be one of the leading suppliers which has shipped more or less 12 billion of devices over the past 10 years. The Serial EEPROM are utilized to save personal preferences and configuration data ...
Atmel
。.. Kbits to 32 Mbits. Users can choose between a fully integrated solution in a DIP package that includes a battery, or asurface mountSOIC package that allows for a SNAPHAT detachable or expendable battery.
STMicroelectronics
。.. Significantly increasedmemory& IoT Ready Host connection via Dual-Port内存or SPI netXChip-Carrier for integrated communication The network technology in automation devices from ...
。.. temporary buffers or wherever largermemoryinstances are required in an SoC design. High Speedmemoriesfor performance critical designs High Densitymemoriesfor mainstream and cost ...
NAND-type Flash内存has been changing itsmemorycell structure, cell size, and functions, and increases in its capacity and reductions to its cost have been undergoing rapid promotion through downsizing. ...
Exceptional Speed, High Reliability, Low Energy Consumption High-performingmemoryempowers faster, powerful solutions. Samsung DDR4 delivers top speed with better bandwidth and reliability using less energy. An ...
Samsung Semiconductor
内存capacity: 8, 6, 5, 4, 2 GB
DDC's DDR2 SDRAM is the 1st and only hermetically sealed ceramic DDR2内存for space, and features high speed operation with up to 8 Gbits ofmemory。Optional RAD-PAK® shielding provides greater total ...
Data Device Corporation
。.. stacked three-dimensional (3D) flashmemory, BiCS FLASH, has far higher die area density compared to the prior state-of-the-art technology, two-dimensional (2D) NAND flashmemory。此外,BiCS闪光……
Your suggestions for improvement:
Receive updates on this section every two weeks.
Please refer to ourPrivacy Policyfor details on how DirectIndustry processes your personal data.
- Brand list
- Manufacturer account
- Buyer account
- Our services
- Newsletter subscription
- About VirtualExpo Group
Please specify:
Help us improve:
remaining