翻转芯片模具HB75

环氧树脂

使用带电动的Z-轴和我们的Die Bonder HB75模具粘合任务可以轻松且精确地处理。触摸屏易于处理和控制6,5英寸TFT我们的长期测试的6,5“控制面板为您提供与我们的产品的直观入口键合。所有流程随时可见。3in1债券可旋转的债券用于changing from dispensing to stamping and placing HB75’s rotation bond head includes a pickup tool, a stamping tool and an epoxy dispenser. Pick & Place with integrated vacuum pump With the HB75, picking up chips or small parts from the die carrier and its placement on the substrate is simple and accurate.